Toshiba och Western Digital tillkännager BICS4 3D NAND med 96 lager

Älskar kommentarsfälten: 1; "The first is 256Gb, they state that.
The Toshiba press release provides some additional insight.

"This 96-layer BiCS FLASH™ will be manufactured at Yokkaichi Operations in Fab 5, the new Fab 2, and Fab 6, which will open in summer 2018. "
So they won't ship much in 2018 if the fabs open in the summer but they might ship a little if nothing goes wrong.

"a capacity increase of approximately 40% per unit chip size over the 64-layer stacking process"
50% more layers, 40% increase in capacity, remains to be seen why and if it's about enabling QCL or 96 layer without string stacking.

You do need to slow it down with the string stacking rhetoric before you have at least some kind of hint that Tosh/WD are using it. The other week you made the claim that their 64L is using string stacking and there is zero support for that claim Today you assume that this product that is 1.5 years away uses it but that's also baseless. They might use it but we got no reason to assume one way or the other."

2; I'm not reading that the way you are. I think the "will open in summer 2018" qualifier is only applied to Fab 6. Fabs 5 and 2's timelines are independent of that fab 6 project.

3; Conversion disrupts output, they are better off ramping the new capacity first and converting the other 2 location once they get to yield.